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Alumina Ceramic discs with High Purity
Formed by cold isostatic pressing and sintered under high temperature, then precision machined and polished, the ceramic spare parts can meet any strict requirements of semiconductor equipment with its features of wear resistance, corrosion resistance, low thermal expansion, and insulation. Ceramics can work in many kinds of semiconductor production equipment with condition of high temperature, vacuum or corrosive gas for a long time.
Made from high-purity alumina powder, processed by cold isostatic pressing, high temperature sintering and precision finishing, it could reach the dimension tolerance to ±0.001 mm, surface finish Ra 0.1, temperature resistance 1600℃.
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alumina ceramic arm
Formed by cold isostatic pressing and sintered under high temperature, then precision machined and polished, the ceramic spare parts can meet any strict requirements of semiconductor equipment with its features of wear resistance, corrosion resistance, low thermal expansion, and insulation. Ceramics can work in many kinds of semiconductor production equipment with condition of high temperature, vacuum or corrosive gas for a long time.
Made from high-purity alumina powder, processed by cold isostatic pressing, high temperature sintering and precision finishing, it could reach the dimension tolerance to ±0.001 mm, surface finish Ra 0.1, temperature resistance 1600℃.
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Ceramic Insulation Rings Ceramic Focusing Rings
Formed by cold isostatic pressing and sintered under high temperature, then precision machined and polished, the ceramic spare parts can meet any strict requirements of semiconductor equipment with its features of wear resistance, corrosion resistance, low thermal expansion, and insulation. Ceramics can work in many kinds of semiconductor production equipment with condition of high temperature, vacuum or corrosive gas for a long time.
Made from high-purity alumina powder, processed by cold isostatic pressing, high temperature sintering and precision finishing, it could reach the dimension tolerance to ±0.001 mm, surface finish Ra 0.1, temperature resistance 1600℃.
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ST.CERA Alumina Ceramic Clamp Ring Insulation Protection
Formed by cold isostatic pressing and sintered under high temperature, then precision machined and polished, the ceramic spare parts can meet any strict requirements of semiconductor equipment with its features of wear resistance, corrosion resistance, low thermal expansion, and insulation. Ceramics can work in many kinds of semiconductor production equipment with condition of high temperature, vacuum or corrosive gas for a long time.
Made from high-purity alumina powder, processed by cold isostatic pressing, high temperature sintering and precision finishing, it could reach the dimension tolerance to ±0.001 mm, surface finish Ra 0.1, temperature resistance 1600℃.
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High-Purity Alumina Ceramic Robot Arm for Wafer Handling
St.Cera’s alumina ceramic robot arm is precision-engineered from 99.8% high-purity Al₂O₃ (alumina). It combines exceptional flexural strength (361 MPa), high hardness (16 GPa), and low density (3.93 g/cm³), resulting in a lightweight yet rigid arm for semiconductor wafer transfer. The material’s thermal expansion coefficient (7.2×10⁻⁶/°C) matches silicon closely, minimizing thermal mismatch during processing.
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Alumina High-Precision Ceramic Ring Ceramic Parts
Formed by cold isostatic pressing and sintered under high temperature, then precision machined and polished, the ceramic spare parts can meet any strict requirements of semiconductor equipment with its features of wear resistance, corrosion resistance, low thermal expansion, and insulation. Ceramics can work in many kinds of semiconductor production equipment with condition of high temperature, vacuum or corrosive gas for a long time.
Made from high-purity alumina powder, processed by cold isostatic pressing, high temperature sintering and precision finishing, it could reach the dimension tolerance to ±0.001 mm, surface finish Ra 0.1, temperature resistance 1600℃.
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ST.CERA Customized Semiconductor Equipment Ceramic Chucks
Formed by cold isostatic pressing and sintered under high temperature, then precision machined and polished, the ceramic spare parts can meet any strict requirements of semiconductor equipment with its features of wear resistance, corrosion resistance, low thermal expansion, and insulation. Ceramics can work in many kinds of semiconductor production equipment with condition of high temperature, vacuum or corrosive gas for a long time.
Made from high-purity alumina powder, processed by cold isostatic pressing, high temperature sintering and precision finishing, it could reach the dimension tolerance to ±0.001 mm, surface finish Ra 0.1, temperature resistance 1600℃.
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Silicon Carbide (SiC) Ceramic End Effector – High Stiffness for High-Temperature Wafer Handling
St.Cera’s SiC ceramic end effector is manufactured from high-purity silicon carbide (SiC content 99.72%, free Si 0.05%) using the S1111 batch material. It offers exceptional mechanical properties: flexural strength 449 MPa (measured), elastic modulus 457 GPa (measured), and Vickers hardness 25–28 GPa (typical). The low density (3.10–3.15 g/cm³, typical) provides a high specific stiffness, ideal for high-speed wafer transfer robots. With thermal conductivity of 120–150 W/m·K (typical) and thermal expansion coefficient of 4.0–4.5×10⁻⁶/℃ (typical), this end effector effectively dissipates heat and maintains dimensional stability during high-temperature handling (up to 1600–1700°C, no load). The black/gray color and zero water absorption ensure cleanroom compatibility.
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Silicon Carbide (SiC) Based Vacuum Chuck for High-Temperature & Plasma Environments
St.Cera’s SiC-based ceramic chuck is manufactured from high-purity silicon carbide (batch S1111, SiC 99.72%, free Si 0.05%). It delivers measured flexural strength of 449 MPa, fracture toughness of 3.12 MPa·m¹/², and elastic modulus of 457 GPa. The material’s typical thermal conductivity (120–150 W/m·K) and low thermal expansion (4.0–4.5×10⁻⁶/℃) enable rapid temperature ramping and minimal wafer warpage during thermal cycling. The chuck can be configured as a porous vacuum chuck (uniform gas flow) or a grooved standard chuck. With a maximum use temperature of 1600–1700°C (no load) and exceptional plasma erosion resistance, this chuck is ideal for high-temperature wafer processing (annealing, RTP) and aggressive etch chambers where alumina chucks degrade.
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Semiconductor Equipment Ceramic Spare Parts Ceramic Carriers
Formed by cold isostatic pressing and sintered under high temperature, then precision machined and polished, the ceramic spare parts can meet any strict requirements of semiconductor equipment with its features of wear resistance, corrosion resistance, low thermal expansion, and insulation. Ceramics can work in many kinds of semiconductor production equipment with condition of high temperature, vacuum or corrosive gas for a long time.
Made from high-purity alumina powder, processed by cold isostatic pressing, high temperature sintering and precision finishing, it could reach the dimension tolerance to ±0.001 mm, surface finish Ra 0.1, temperature resistance 1600℃.
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Metal-Backed Alumina Ceramic Grinding Ring for High-Rigidity Lapping Applications
St.Cera’s metal based alumina grinding ring combines a high-purity alumina (99.8% Al₂O₃) ceramic wear layer with a precision-machined metal backing (typically aluminum or stainless steel). This hybrid design provides the exceptional wear resistance and chemical inertness of ceramic on the grinding surface, while the metal base adds mechanical strength, easy mounting, and resistance to brittle fracture. The alumina layer offers flexural strength of 361 MPa, Vickers hardness of 16 GPa, and thermal stability up to 800°C. The metal base is customized with mounting holes, locating pins, or magnetic properties for integration into lapping machines, planetary grinders, and CMP equipment.
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Ceramic Spare Parts for Semiconductor Probe Station Equipment
Formed by cold isostatic pressing and sintered under high temperature, then precision machined and polished, the ceramic spare parts can meet any strict requirements of semiconductor equipment with its features of wear resistance, corrosion resistance, low thermal expansion, and insulation. Ceramics can work in many kinds of semiconductor production equipment with condition of high temperature, vacuum or corrosive gas for a long time.
Made from high-purity alumina powder, processed by cold isostatic pressing, high temperature sintering and precision finishing, it could reach the dimension tolerance to ±0.001 mm, surface finish Ra 0.1, temperature resistance 1600℃.
