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Silicon Carbide (SiC) Ceramic End Effector – High Stiffness for High-Temperature Wafer Handling

Silicon Carbide (SiC) Ceramic End Effector – High Stiffness for High-Temperature Wafer Handling

Short Description:

St.Cera’s SiC ceramic end effector is manufactured from high-purity silicon carbide (SiC content 99.72%, free Si 0.05%) using the S1111 batch material. It offers exceptional mechanical properties: flexural strength 449 MPa (measured), elastic modulus 457 GPa (measured), and Vickers hardness 25–28 GPa (typical). The low density (3.10–3.15 g/cm³, typical) provides a high specific stiffness, ideal for high-speed wafer transfer robots. With thermal conductivity of 120–150 W/m·K (typical) and thermal expansion coefficient of 4.0–4.5×10⁻⁶/℃ (typical), this end effector effectively dissipates heat and maintains dimensional stability during high-temperature handling (up to 1600–1700°C, no load). The black/gray color and zero water absorption ensure cleanroom compatibility.


Product Detail

Product Tags

St.Cera’s SiC ceramic end effector is manufactured from high-purity silicon carbide (SiC content 99.72%, free Si 0.05%) using the S1111 batch material. It offers exceptional mechanical properties: flexural strength 449 MPa (measured), elastic modulus 457 GPa (measured), and Vickers hardness 25–28 GPa (typical). The low density (3.10–3.15 g/cm³, typical) provides a high specific stiffness, ideal for high-speed wafer transfer robots. With thermal conductivity of 120–150 W/m·K (typical) and thermal expansion coefficient of 4.0–4.5×10⁻⁶/℃ (typical), this end effector effectively dissipates heat and maintains dimensional stability during high-temperature handling (up to 1600–1700°C, no load). The black/gray color and zero water absorption ensure cleanroom compatibility.

 

Specifications (based on supplied SiC S1111 test report & typical values):

Property Value
Material SiC (99.72% SiC, 0.05% Free Si)
Color Black/Gray
Density 3.10–3.15 g/cm³
Water Absorption 0%
Flexural Strength 449 MPa (average)
Fracture Toughness 3.12 MPa·m¹/² (average)
Elastic Modulus 457 GPa
Vickers Hardness 25–28 GPa
Thermal Conductivity (25°C) 120–150 W/m·K
CTE (25–1000°C) 4.0–4.5×10⁻⁶/℃
Max Use Temp (no load) 1600–1700°C

 

Applications:

● High-temperature wafer handling (post-anneal, RTP, epitaxy)

● Plasma etch chambers requiring high erosion resistance

● High-speed transfer robots (lightweight, high stiffness)

 

Manufacturing:

SiC powder sintering → precision CNC grinding of arm profile and mounting features → surface lapping → ultrasonic cleaning. 100% dimensional inspection and helium leak test for vacuum applications.

 

Quality Control:

● CMM inspection of length, width, and flatness

● Flexural strength test per batch (per test report standard)

● Visual inspection under microscope for surface defects

 

Advantages over Alumina or Metal:

● 2× higher elastic modulus (457 vs ~380 GPa for alumina) – less deflection

● 3× higher thermal conductivity – faster heat dissipation

● Withstands >1600°C vs alumina’s 800°C in air

● Lower density than steel – 40% weight reduction

 

Customization:

Lengths 150–450 mm, tip shapes (edge grip, Bernoulli, flat), mounting flange patterns per OEM drawing.

*All mechanical data above comes from the supplied test report (batch S1111). Thermal and hardness values are typical for this SiC grade; please contact us for lot-specific certification.*


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