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High-Purity Alumina Ceramic Seal Ring for High-Temperature Chamber Sealing
St.Cera‘s ceramic seal ring is designed as an alternative to polymer O-rings in extreme environments where elastomers degrade. Manufactured from 99.8% high-purity alumina (Al₂O₃), this rigid seal ring is used in static sealing applications — typically paired with a soft metal or graphite gasket — to provide reliable vacuum or gas containment at temperatures up to 800°C and in aggressive plasma or chemical environments. The material offers zero outgassing, high compressive strength (underlying flexural strength 361 MPa), and chemical inertness (resistant to halogens, acids, and alkalis except HF). Precision-lapped sealing surfaces (flatness ≤5 μm, surface roughness Ra ≤0.2 μm) ensure leak-tight contact with mating metal or ceramic components.
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High-Purity Alumina Chamber Focus Ring for Plasma Etch & CVD Systems
St.Cera‘s chamber focus ring is a critical process kit component used in plasma etch, CVD, and PVD semiconductor equipment. Manufactured from 99.8% high-purity alumina (Al₂O₃), the ring surrounds the wafer edge to confine plasma and optimize ion angular distribution, thereby improving etch uniformity across the wafer surface. The material offers exceptional plasma resistance, high dielectric strength (15×10⁶ V/m), and thermal stability up to 1600°C, ensuring long-term reliability in aggressive fluorine- or chlorine-based plasma environments. Precision-ground ID/OD and flatness (≤10 μm) enable accurate wafer edge positioning, reducing edge defects and particle generation.
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High-Purity Alumina Ceramic Ring for CVD / PVD Process Chambers
St.Cera‘s ceramic ring is specifically designed for use in CVD (Chemical Vapor Deposition) and PVD (Physical Vapor Deposition) process chambers. Manufactured from 99.8% high-purity alumina (Al₂O₃), this ring serves as a chamber liner, focus ring, or process kit component to confine plasma and protect chamber walls from erosion. The material offers excellent plasma resistance, high dielectric strength (15×10⁶ V/m), and thermal stability up to 1600°C, ensuring long service life in aggressive fluorine-based plasma environments. Precise dimensional tolerances (±0.05 mm on ID/OD) and flatness (≤10 μm) enable consistent wafer edge positioning, improving deposition uniformity and reducing particle generation.
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High-Purity Alumina Ceramic Parts for Semiconductor & Industrial Applications
St.Cera manufactures precision-machined alumina (Al₂O₃) ceramic parts to customer specifications. Using 99.8% high-purity alumina, these components deliver excellent flexural strength (361 MPa), high hardness (16 GPa), and outstanding dielectric strength (15×10⁶ V/m). Designed for semiconductor equipment, wear-resistant assemblies, electrical insulators, and high-temperature fixtures, the material offers near-zero water absorption (0%) and a thermal expansion coefficient of 7.2×10⁻⁶/℃, ensuring dimensional stability under extreme conditions.
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Porous Ceramic Vacuum Chuck for Warped Wafer Handling
St.Cera’s porous ceramic chuck is engineered from high-purity alumina with a uniform open porosity of 30–45% and pore sizes ranging from 10 to 100 μm. Unlike conventional grooved chucks, the porous surface provides distributed vacuum across the entire wafer backside, effectively holding warped, thin, or singulated wafers without edge lift-off or breakage. The gentle vacuum (adjustable via restrictor) also prevents backside marking.
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Alumina-Based Porous Ceramic Vacuum Chuck for Thin Wafer Handling
St.Cera’s alumina-based porous chuck is fabricated from 99.6% high-purity Al₂O₃ with controlled open porosity of 30–45% and uniform pore size ranging from 10 to 50 μm. Unlike grooved chucks, the porous surface provides distributed vacuum across the entire wafer backside, eliminating edge marking and enabling gentle holding of ultra-thin (≤100 μm) or warped wafers. The material offers flexural strength ≥250 MPa and thermal stability up to 400°C in air.
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Alumina Gas Distribution Plate for CVD/PVD Showerhead
St.Cera’s gas distribution plate (showerhead) is precision-machined from high-purity 99.8% alumina ceramic. It features an array of micro-holes (diameters 0.3–1.5 mm) that ensure uniform gas flow across the wafer surface during CVD, PVD, or ALD processes. The plate’s high dielectric strength (>15×10⁶ V/m) and plasma resistance make it essential for semiconductor thin-film deposition.
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High-Purity Alumina Ceramic Core for Semiconductor Fixtures
St.Cera’s alumina ceramic core is precision formed from 99.8% high-purity Al₂O₃, offering exceptional dielectric strength (15×10⁶ V/m), thermal stability up to 1600°C, and creep resistance under load. These cores are used as structural components in high-temperature process fixtures, heater bases, plasma chamber liners, and electrical insulators. The material’s high hardness (16 GPa) and low water absorption (0%) ensure long-term reliability in harsh environments.
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Alumina-Based Standard Vacuum Chuck – High Rigidity for Precision Machining
This alumina-based vacuum chuck is manufactured from 99.8% Al₂O₃, offering a smooth non-porous surface with custom vacuum groove patterns. It provides exceptional rigidity (Young’s modulus 380 GPa) and flatness (≤3 μm), making it ideal for precision grinding, lapping, and dicing of semiconductor wafers and optical components. The material’s high thermal conductivity (32 W/m·k) ensures temperature uniformity during processing.
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12-Inch Alumina Vacuum Chuck for 300mm Wafer Processing
St.Cera’s 12-inch vacuum chuck is precision-engineered from 99.8% high-purity alumina (Al₂O₃) for 300mm wafer handling. The chuck features a fine-grooved surface (groove width 0.5–1.0 mm, pitch 2–3 mm) to ensure uniform vacuum distribution across the entire 300mm diameter. Flatness is maintained within 5 μm, enabling warp-free wafer fixation during dicing, backside grinding, and inspection. The material’s high flexural strength (361 MPa) and hardness (16 GPa) guarantee long-term dimensional stability even under repeated vacuum cycles.
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ST.CERA Customized for Alumina Ceramic Ring and Ceramic Disc
Formed by cold isostatic pressing and sintered under high temperature, then precision machined and polished, the ceramic spare parts can meet any strict requirements of semiconductor equipment with its features of wear resistance, corrosion resistance, low thermal expansion, and insulation. Ceramics can work in many kinds of semiconductor production equipment with condition of high temperature, vacuum or corrosive gas for a long time.
Made from high-purity alumina powder, processed by cold isostatic pressing, high temperature sintering and precision finishing, it could reach the dimension tolerance to ±0.001 mm, surface finish Ra 0.1, temperature resistance 1600℃.
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ST.CERA Alumina Ceramic Clamp Ring Insulation Protection
Formed by cold isostatic pressing and sintered under high temperature, then precision machined and polished, the ceramic spare parts can meet any strict requirements of semiconductor equipment with its features of wear resistance, corrosion resistance, low thermal expansion, and insulation. Ceramics can work in many kinds of semiconductor production equipment with condition of high temperature, vacuum or corrosive gas for a long time.
Made from high-purity alumina powder, processed by cold isostatic pressing, high temperature sintering and precision finishing, it could reach the dimension tolerance to ±0.001 mm, surface finish Ra 0.1, temperature resistance 1600℃.
