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High-Purity Alumina Ceramic Grinding Plate for Precision Lapping

High-Purity Alumina Ceramic Grinding Plate for Precision Lapping

Short Description:

St.Cera’s ceramic grinding plate is manufactured from 99.8% high-purity alumina (Al₂O₃) for precision lapping and grinding applications. Our precision grinding capability achieves flatness of 0.003mm, parallelism of 0.002mm, and surface finish of Ra0.1, ensuring uniform material removal across the entire plate surface. The plate offers excellent wear resistance (Vickers 16 GPa), high flexural strength (361 MPa), and thermal stability up to 800°C. Available in round formats up to 600mm diameter and rectangular plates up to 1500mm length. Grooved surfaces (groove width 0.5–2.0mm) are available for slurry distribution in lapping processes. Each plate is inspected with laser interferometer and supplied with a precision measurement report.

 


Product Detail

Product Tags

St.Cera’s ceramic grinding plate is manufactured from 99.8% high-purity alumina (Al₂O₃) for precision lapping and grinding applications. Our precision grinding capability achieves flatness of 0.003mm, parallelism of 0.002mm, and surface finish of Ra0.1, ensuring uniform material removal across the entire plate surface. The plate offers excellent wear resistance (Vickers 16 GPa), high flexural strength (361 MPa), and thermal stability up to 800°C. Available in round formats up to 600mm diameter and rectangular plates up to 1500mm length. Grooved surfaces (groove width 0.5–2.0mm) are available for slurry distribution in lapping processes. Each plate is inspected with laser interferometer and supplied with a precision measurement report.

 

Specifications (based on 99.8% AlO & St.Cera manufacturing capabilities):

Property Value
Material 99.8% Alumina (Ivory)
Density 3.93 g/cm³
Flexural Strength 361 MPa
Vickers Hardness 16 GPa
Outer Diameter (max) 600mm
Length (max) 1500mm
Thickness (max) 100mm
Flatness 0.003mm
Parallelism 0.002mm
Surface Finish Ra0.1
Max Operating Temp 800°C

 

Applications:

  • · Lapping of ceramic substrates and metal seals
  • · Backside grinding of semiconductor wafers
  • · Optical element polishing
  • · Large-format substrate lapping

 

Precision Capabilities:

  • · Straightness: 0.005mm
  • · Perpendicularity: 0.005mm
  • · Roundness: 0.002mm

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