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Alumina Ceramic End Effector with Integrated Vacuum Channels

Alumina Ceramic End Effector with Integrated Vacuum Channels

Short Description:

St.Cera’s alumina vacuum end effector integrates precision-machined vacuum channels and suction holes directly into the 99.8% high-purity alumina body. This design eliminates external vacuum pads, enabling direct wafer pickup with uniform holding force. The material’s high flexural strength (361 MPa) and hardness (16 GPa) ensure long-term dimensional stability under repeated vacuum cycles. Flatness across the pad area is maintained within 10 μm, preventing wafer stress and breakage. Vacuum ports are located at the rear mounting flange for easy integration with OEM robot arms.


Product Detail

Product Tags

St.Cera’s alumina vacuum end effector integrates precision-machined vacuum channels and suction holes directly into the 99.8% high-purity alumina body. This design eliminates external vacuum pads, enabling direct wafer pickup with uniform holding force. The material’s high flexural strength (361 MPa) and hardness (16 GPa) ensure long-term dimensional stability under repeated vacuum cycles. Flatness across the pad area is maintained within 10 μm, preventing wafer stress and breakage. Vacuum ports are located at the rear mounting flange for easy integration with OEM robot arms.

 

Specifications (based on 99.8% Al₂O₃):

Property Value
Material 99.8% Alumina (Ivory)
Density 3.93 g/cm³
Flexural Strength 361 MPa
Vickers Hardness 16 GPa
Young’s Modulus 380 GPa
Thermal Expansion 7.2×10⁻⁶/℃
Pad Flatness ≤10 μm
Vacuum Channel Width 0.5–2.0 mm
Max Operating Temp 800°C

 

Applications:

● Vacuum pickup of thin or warped wafers

● Direct wafer handling without edge gripping

● Solar cell and LED substrate transfer

 

Manufacturing:

Sintered alumina blank → 5-axis CNC drilling of vacuum channels and holes → surface lapping → ultrasonic cleaning → helium leak test. Each effector is 100% flow-tested for vacuum uniformity.

 

Advantages:

● No external vacuum pads (reduces particle sources)

● Uniform holding pressure prevents wafer marking

● Chemically inert and cleanroom compatible


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