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High-Purity Alumina Ceramic End Effector for Wafer Handling Robots

High-Purity Alumina Ceramic End Effector for Wafer Handling Robots

Short Description:

St.Cera’s alumina ceramic end effector is precision machined from 99.8% high-purity Al₂O₃ using advanced 5-axis CNC grinding equipment. Our manufacturing capabilities include precision grinding machines and CNC machining centers, enabling complex geometries with high precision. The end effector features a thin profile (as thin as 1.5 mm) with a tapered leading edge for smooth wafer insertion. The material provides high stiffness (Young’s modulus 380 GPa), excellent wear resistance, and thermal stability up to 800°C. Each unit is precision ground to achieve flatness of 0.003mm, parallelism of 0.002mm, and surface finish of Ra0.1, ensuring consistent wafer contact and particle-free operation in semiconductor FAB environments. Available in lengths from 150 mm to 450 mm, with custom tip geometries (edge grip, Bernoulli, flat) and mounting flanges to fit OEM robots. Surface finish options include lapped, polished, or ESD dissipative coating (10⁶–10⁹ Ω/sq).


Product Detail

Product Tags

St.Cera’s alumina ceramic end effector is precision machined from 99.8% high-purity Al₂O₃ using advanced 5-axis CNC grinding equipment. Our manufacturing capabilities include precision grinding machines and CNC machining centers, enabling complex geometries with high precision. The end effector features a thin profile (as thin as 1.5 mm) with a tapered leading edge for smooth wafer insertion. The material provides high stiffness (Young’s modulus 380 GPa), excellent wear resistance, and thermal stability up to 800°C. Each unit is precision ground to achieve flatness of 0.003mm, parallelism of 0.002mm, and surface finish of Ra0.1, ensuring consistent wafer contact and particle-free operation in semiconductor FAB environments. Available in lengths from 150 mm to 450 mm, with custom tip geometries (edge grip, Bernoulli, flat) and mounting flanges to fit OEM robots. Surface finish options include lapped, polished, or ESD dissipative coating (10⁶–10⁹ Ω/sq).

 

Specifications (based on 99.8% AlO & St.Cera manufacturing capabilities):

Property Value
Material 99.8% Alumina (Ivory)
Density 3.93 g/cm³
Flexural Strength 361 MPa
Vickers Hardness 16 GPa
Young’s Modulus 380 GPa
Flatness 0.003mm
Parallelism 0.002mm
Surface Finish Ra0.1 (lapped/polished)
Max Operating Temp 800°C
Length Range 150–450 mm

 

Applications:

  • · Wafer transfer in vacuum and atmospheric robots
  • · FAB automation end effectors for 200mm/300mm wafers
  • · Thin wafer handling (with ESD option)

 

Manufacturing Capabilities:
Our precision grinding machines and CNC machining centers enable the production of complex ceramic components with:

  • · Maximum machining length: 1500mm
  • · Maximum outer diameter: 600mm
  • · Minimum inner diameter: 0.2mm
  • · Maximum thickness: 100mm

 

Quality Control:
Straightness 0.005mm, perpendicularity 0.005mm, roundness 0.002mm, parallelism 0.002mm, concentricity 0.01mm verified by CMM. Each unit is ultrasonically cleaned and Class 100 cleanroom packaged.


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