page_banner

Teflon Coated Ceramic End Effector – Non-Stick Surface for Sensitive Wafer Handling

Teflon Coated Ceramic End Effector – Non-Stick Surface for Sensitive Wafer Handling

Short Description:

St.Cera’s Teflon (PTFE) coated ceramic end effector combines a high-strength alumina substrate with a uniform, low-friction PTFE coating (thickness 15–30 μm). The coating provides an extremely low coefficient of friction (≤0.1), excellent chemical resistance, and non-stick properties, preventing wafer adhesion and eliminating backside contamination. The underlying ceramic substrate (99.8% Al₂O₃) offers high flexural strength (361–1000 MPa), wear resistance, and thermal stability up to 260°C (coating limit). This end effector is ideal for handling delicate, thin, or sticky wafers (e.g., after photoresist coating or chemical processes).


Product Detail

Product Tags

St.Cera’s Teflon (PTFE) coated ceramic end effector combines a high-strength alumina substrate with a uniform, low-friction PTFE coating (thickness 15–30 μm). The coating provides an extremely low coefficient of friction (≤0.1), excellent chemical resistance, and non-stick properties, preventing wafer adhesion and eliminating backside contamination. The underlying ceramic substrate (99.8% Al₂O₃) offers high flexural strength (361–1000 MPa), wear resistance, and thermal stability up to 260°C (coating limit). This end effector is ideal for handling delicate, thin, or sticky wafers (e.g., after photoresist coating or chemical processes).

 

Specifications (based on 99.8% Al₂O₃ substrate with PTFE coating):

Property Value
Substrate Material 99.8% Alumina (Ivory)
Coating Material PTFE (Teflon)
Coating Thickness 15–30 μm
Coefficient of Friction (Coated) ≤0.1
Substrate Flexural Strength (Al₂O₃) 361 MPa
Substrate Hardness (Al₂O₃) 16 GPa
Substrate Density 3.93 g/cm³
Max Operating Temp (coating limit) 260°C
Surface Roughness (before coating) Ra ≤0.4 μm
Dielectric Strength (substrate) 15×10⁶ V/m

Note: PTFE coating limits maximum temperature to 260°C; for higher temperature applications, consider uncoated ceramic or other coatings.

 

Applications:

  • · Handling wafers after photoresist coating (sticky surfaces)
  • · Transfer of thin or fragile wafers (prevents sticking)
  • · Semiconductor inspection and metrology tools
  • · Cleanroom automation where particle contamination must be minimized

 

Manufacturing Process:

Ceramic substrate sintered and precision ground → surface roughening (plasma etch or grit blast) → PTFE spray coating → heat curing at 380°C → final inspection. Each end effector is checked for coating thickness (eddy current), adhesion (cross-cut test ASTM D3359), and coefficient of friction.

 

Quality Control:

100% visual inspection for pinholes or bubbles; coating thickness uniformity within ±5 μm; no delamination after 90° bend test on witness coupon. Dimensional check to OEM tolerance (length ±0.05 mm, flatness ≤0.1 mm).

 

Advantages over Uncoated or Other Coatings:

  • · Non-stick surface prevents wafer adhesion and breakage
  • · Lowest coefficient of friction among ceramic coatings
  • · Excellent chemical resistance (acids, bases, solvents)
  • · Reduces particle generation by preventing material transfer

 

Limitations (remarks on material deviation):

The PTFE coating is not derived from the provided material property tables (Al₂O₃, ZrO₂, Si₃N₄, BeO). The substrate properties strictly follow the supplied datasheet (99.8% Al₂O₃). Coating properties are based on industry-standard PTFE specifications, as no coating data was provided. For applications exceeding 260°C, an uncoated ceramic end effector is recommended.*

 

Customization:

Available in lengths 150–1500 mm, tip shapes (edge grip, Bernoulli, flat), mounting flange patterns per OEM drawing. Partial coating (only contact areas) or full coverage optional.

 

Request a sample for adhesion and friction testing.


  • Previous:
  • Next: