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High-Purity Alumina Ceramic Robot Arm for Wafer Handling
St.Cera’s alumina ceramic robot arm is precision-engineered from 99.8% high-purity Al₂O₃ (alumina). It combines exceptional flexural strength (361 MPa), high hardness (16 GPa), and low density (3.93 g/cm³), resulting in a lightweight yet rigid arm for semiconductor wafer transfer. The material’s thermal expansion coefficient (7.2×10⁻⁶/°C) matches silicon closely, minimizing thermal mismatch during processing.
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Bernoulli Ceramic End Effector — Non-Contact Wafer Handling for Thin & Fragile Wafers
St.Cera‘s Bernoulli ceramic end effector uses aerodynamic lift to handle wafers without physical contact. Manufactured from high-purity 99.8% alumina (Al₂O₃) or silicon carbide (SiC), it features precision-machined nozzles that eject pressurized gas to create a thin air film between the end effector and the wafer. This non-contact principle eliminates backside contamination, edge chipping, and surface damage, making it ideal for thin (≤100 μm), fragile, or warped wafers. The ceramic substrate provides high flexural strength (361 MPa for Al₂O₃; up to 550–600 MPa for SiC), low mass, and excellent dimensional stability, ensuring repeatable positioning in high-speed wafer transfer robots.
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Teflon Coated Ceramic End Effector – Non-Stick Surface for Sensitive Wafer Handling
St.Cera’s Teflon (PTFE) coated ceramic end effector combines a high-strength alumina substrate with a uniform, low-friction PTFE coating (thickness 15–30 μm). The coating provides an extremely low coefficient of friction (≤0.1), excellent chemical resistance, and non-stick properties, preventing wafer adhesion and eliminating backside contamination. The underlying ceramic substrate (99.8% Al₂O₃) offers high flexural strength (361–1000 MPa), wear resistance, and thermal stability up to 260°C (coating limit). This end effector is ideal for handling delicate, thin, or sticky wafers (e.g., after photoresist coating or chemical processes).
