Alumina-Based Standard Vacuum Chuck – High Rigidity for Precision Machining
This alumina-based vacuum chuck is manufactured from 99.8% Al₂O₃, offering a smooth non-porous surface with custom vacuum groove patterns. It provides exceptional rigidity (Young’s modulus 380 GPa) and flatness (≤3 μm), making it ideal for precision grinding, lapping, and dicing of semiconductor wafers and optical components. The material’s high thermal conductivity (32 W/m·k) ensures temperature uniformity during processing.
Specifications (based on 99.8% Al₂O₃):
| Property | Value |
| Material | 99.8% Alumina (Ivory) |
| Density | 3.93 g/cm³ |
| Flexural Strength | 361 MPa |
| Vickers Hardness | 16 GPa |
| Young’s Modulus | 380 GPa |
| Thermal Conductivity | 32 W/m·k |
| Flatness | ≤3 μm (over 200mm) |
| Surface Roughness (chuck side) | Ra ≤0.4 μm |
| Max Operating Temp | 800°C |
Applications:
- · Wafer backside grinding (coarse and fine)
- · Precision dicing of brittle materials
- · Lapping of ceramic substrates
- · Optical lens polishing
Manufacturing:
Precision lapping of both sides → diamond grooving (optional) → edge rounding → ultrasonic cleaning → 100% flatness inspection with laser interferometer.
Advantages:
- · Rigid support minimizes deflection under load
- · No particle generation from porous structure
- · Easy to clean (solvent-wipe compatible)
- · Vacuum grooves customizable (concentric, radial, custom patterns)
Available Sizes:
Round: 100mm, 150mm, 200mm, 300mm; square/rectangular upon request.
We also offer metal-based versions for higher mechanical strength.
