12-Inch Alumina Vacuum Chuck for 300mm Wafer Processing
St.Cera’s 12-inch vacuum chuck is precision-engineered from 99.8% high-purity alumina (Al₂O₃) for 300mm wafer handling. The chuck features a fine-grooved surface (groove width 0.5–1.0 mm, pitch 2–3 mm) to ensure uniform vacuum distribution across the entire 300mm diameter. Flatness is maintained within 5 μm, enabling warp-free wafer fixation during dicing, backside grinding, and inspection. The material’s high flexural strength (361 MPa) and hardness (16 GPa) guarantee long-term dimensional stability even under repeated vacuum cycles.
Specifications (based on 99.8% Al₂O₃):
| Property | Value |
| Diameter | 300 mm (12 inch) |
| Material | 99.8% Alumina (Ivory) |
| Density | 3.93 g/cm³ |
| Flexural Strength | 361 MPa |
| Vickers Hardness | 16 GPa |
| Flatness (over 300mm) | ≤5 μm |
| Groove Width | 0.5–1.0 mm |
| Max Operating Temp | 800°C |
| Dielectric Strength | 15×10⁶ V/m |
Applications:
300mm wafer dicing and scribing
Wafer backside grinding (thin wafer support)
Optical inspection and probing
Temporary bonding/debonding chucks
Manufacturing:
CNC ground and lapped to final flatness, grooved with diamond wheels, ultrasonically cleaned, and packaged in Class 100 cleanroom. Each chuck is 100% inspected for flatness (laser interferometer) and groove depth (profilometer).
Advantages:
Low particle generation (≤0.05 particles/cm²)
Chemically inert to solvents and acids
ESD-safe surface (resistivity >10¹³ Ω·cm)
Custom vacuum hole patterns and backside ports available.
